Metalworking resist for etching (negative type)
Metalworking resist
For etching (negative type)
PHOTORESIST / ETCHING — NEGATIVE TYPE
Metal, Glass, and Silicon Etching FMR Series
Cyclic rubber-based resist (solvent-developable type): Excellent resistance to acids, alkalis, and hydrofluoric acid. Can be removed with cycloic rubber stripping solution.
FMR Series
General-purpose type. Solvent developing. Excellent acid and alkali resistance. Maximum viscosity: 600 mPa·s
FMR-G series
FMR (Focused Polymer) with reduced oxygen inhibition. Maximum viscosity: 380 mPa·s
Metal Etching and Plating FDER Series
Acrylic resist (weak alkali development, strong alkali stripping) Suitable for processing copper and stainless steel plates.
FDER-TF80X
General-purpose type. The cured film is blue for high visibility. Resistant to acidic plating solutions and iron solutions.
FDER-40L-GO
A high-resolution version of the TF80X.
Metal Etching FR Series
Casein-based resist (water-developable type), not classified as a Class 4 hazardous material, excellent acid resistance, can be removed with alkali.
FR-15
Excellent cost performance (casein-based)
FR-17
A high-sensitivity version of the FR-15.
* The listed items represent only a portion of our product range. We also offer customization and modifications to suit your specific needs.
Metalworking resists for etching (positive type) and lift-off applications.
Metalworking resist
For etching (positive type) / for lift-off
PHOTORESIST / ETCHING POSITIVE & LIFT-OFF PROCESS MATERIALS
Metal and glass etching FPPR series (positive type)
Novolac-based resist (NQD type) - Suitable for flat panel and crystal substrate processing, and various wet and dry etching processes.
FPPR-PET series
General-purpose type. Processing of flat panels, crystal substrates, etc.
FPPR-AM series
High sensitivity type.
Lift-off process materials (sputtering and deposition processes) FNPR-L series (negative type)
Lift-off Process Materials: Technical Information
LIFT-OFF PROCESS MATERIALS：TECHNICAL INFORMATION
Capable of creating reverse tapered shapes independently (single layer, single exposure). Suitable for sputtering and metal deposition applications.
FNPR-L series
General-purpose type. Suitable for film thicknesses of 3 to 15 μm. Ideal for applications with low sputtering temperatures. Capable of high-concentration alkali stripping.
FNPR-NHL series
A high-resolution version of the TF80X. High heat-resistant version. Suitable for film thicknesses of 3-8 μm. Can be removed with a dedicated stripping solution.
FNPR-HL series
A high-resolution version of NHL. Compatible with film thicknesses of 0.5 to 1 μm. Can be removed with a dedicated stripping solution.
* The listed items represent only a portion of our product range. We also offer customization and modifications to suit your specific needs.
Other products (our own products)
Other products (our own products)
OTHER PRODUCTS — IN-HOUSE PRODUCTS
Protective film for wafer processing
Process protective films for silicon wafers and glass
NR-5
Insoluble in water. Can be removed with alkali.
* The listed items represent only a portion of our product range. We also offer customization and modifications to suit your specific needs.
Product Inquiries
PRODUCT INQUIRY
The items listed are only a portion of the product.
We also make adjustments and improvements to suit your specific needs.
Please feel free to contact our sales department at the address below for any inquiries regarding our products.
Tokyo Sales Headquarters
TEL
03-3557-6201
FAX
03-3557-6205
Reception hours
Weekdays 9:00 AM - 5:00 PM
Osaka Sales Office
TEL
06-6384-1351
FAX
06-6389-3221
Reception hours
Weekdays 9:00 AM - 5:00 PM